The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies (“SMART-2024”) aims to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. “SMART-2024” seeks to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targets a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.

SMART-2024 differentiates itself from other conferences in similar fields by offering a holistic platform that covers multiple interdisciplinary research domains, emphasizing collaboration, innovation, knowledge exchange and their real-world applications, fostering an environment for networking, and professional growth of both academic, industry and research community. Ultimately, SMART-2024 aims to be a premier international conference shaping the future of technology-enabled solutions.