logo
International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI Architectures based IoT & Future Communication Technologies
logo

Call For Papers

The abstracts/extended abstracts must be submitted through the Microsoft Conference Management Tool Kit (CMT). Each author confirms that he/she is aware of the publication ethics & malpractice statement and the privacy policy of the event. Next, every Submission will undergo a peer review process by at least 2 reviewers and the decisions along with the reviewer comments will be communicated to the corresponding author in due course. The authors are expected to have significant contributions to the article and must meet the guidance of Taylor and Francis publications. The maximum paper length is 6 pages, more than 6 pages should pay INR 500 or 10 USD per page.