VLSI & IoT

• Ultra-Low Power VLSI Design for IoT Devices
• Integration of IoT Sensors and Actuators in VLSI Systems
• Energy-Efficient Circuit Design for IoT Applications
• IoT Edge Computing Architectures and VLSI Implementations
• Security and Privacy Considerations in VLSI-based IoT Systems
• Custom ASIC Designs for IoT Sensor Nodes
• VLSI-based Energy Harvesting Techniques for IoT Devices
• Embedded Machine Learning and AI for IoT on VLSI Chips.

Communication

• 5G and 6G Standardization and Roadmaps
• Massive MIMO and Beamforming in 5G and 6G Systems
• Ultra-Reliable Low Latency Communications (URLLC) in 5G and 6G
• Artificial Intelligence and Machine Learning in 5G and 6G Systems
• Edge Computing and Mobile Edge Computing (MEC) in 5G and 6G Networks
• Wireless Network Resilience and Reliability for 5G and 6G
• Satellite Integration and Space-based Communications for 6G
• 6G Use Cases and Beyond Future Applications and Services.

Devices & circuits

• Compact device modeling for energy efficiency
• Quantum electronics, Ballistic transport mechanism
• Emerging devices & and characteristics (FINFETS, TFET)
• Beyond CMOS –III-IV HEMT Ga2o3, HEMT UWB Semiconductor SET
• 2D, 3D Materials graphite, spintronics, CNT-FETS, Nanotubes
• Flexible electronics & and wearable devices
• Energy storage, High-efficiency solar cells
• Analog, digital, mixed-signal VLSI circuits
• System on chip, Bio electronics
• Reconfigurable circuits & and optimizing techniques
• HDL-based FPGA design, testing, and verification

Semiconductor Packaging

• Advanced VLSI Packaging Technologies
• 3D Integrated Circuit Packaging
• System-in-Package (SiP) Design and Integration
• Fan-Out Wafer Level Packaging (FOWLP)
• Flip-Chip and Chip-on-Board Packaging
• Interconnects and Micro-bumps for VLSI Packaging
• Wafer-Level Chip Scale Packaging (WLCSP)
• Thermal Management in VLSI Packaging
• Electrical and Mechanical Reliability of VLSI Packages
• Wire Bonding and Die Attach Techniques
• VLSI Packaging Materials and Substrates

AI &ML

• Multi-Chip Module (MCM) Packaging AIML & VLSI
• AI/ML Hardware Accelerators for VLSI Systems
• Neuromorphic Computing Architectures and VLSI Implementation
• Edge Computing and VLSI Integration for AI Applications
• Hardware-aware Machine Learning Algorithms for VLSI Design
• VLSI-based Deep Learning Accelerators
• Energy-efficient AI/ML Hardware Design for IoT Devices
• Reconfigurable Hardware Platforms for Data Science and ML
• Hardware Security for AI/ML Models in VLSI Systems

Nano Materials

• Biomaterials & Biosensing
• Materials for energy storage conversion
• Computational material science and modelling
• Surface engineering thin film & and coating
• Emerging materials and latest technologies
• Materials bonding Electronics & Photonics
• Materials for green energy storage
• Materials for sustainable development
• Material recycling & waste management